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Instrument >> Instrument for Wafer >> Semi-Automatic Contactless Wafer Detector:HS-NCS-200SA

Products Brief:

Semi-Automatically, non-contact measurement of wafer thickness, TTV ,bow,Point and flatness.Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.the powerful software can test all the data above within several seconds,all the design according to SEMI standard and the ASTM,make sure the data can be easily unify. the system can used for several sample size,like 75 mm, 100 mm, 125 mm, 150 mm, 200 mm

Product's Feature:

■ Non-contact Measurements.

■ Semi-automation system, can improve the measure thoughput.
■ Can be used on all wafer materials including: Silicon，Gallium-Arsenide，Indium Phosphide，Germanium.
■ Thickness and TTV values are obtained by placing the wafer between non-contact capacitance probes.
■ Thickness and TTV values are indicated on the high resolution LCD display.
■ Provides High Performance at Low Cost.
■ Menu-driven for Fast, Easy Setup.
■ High-resolution LCD Display.
■ RS-232 Output Port to PC.
■ Parallel Port for Printer.
■ Portable and Easy to Set Up
■ provides the user precise non-contact measurements at critical points throughout the wafer manufacturing process.
■ On-board Microprocessor for Accurate, Repeatable Measurements.
■ Teflon Wafer Stage for Easy, Non-abrasive Positioning.

Technique Specification:

■ Wafer Sizes: 75 mm, 100 mm, 125 mm, 150 mm, 200 mm

■ Measurement Range: 1mm standard [1.7 mm Extended]
■ Thickness Accuracy: +/-0.25um
■ Repeatability: 0.050um

■ TTV Accuracy: +/-0.05um
■ Repeatability: 0.050um

■ Bow Range: +/-500um [+/-850um]
■ Accuracy :+/-2.0um
■ Repeatability: 0.750um

■ Material:Silicon，Gallium-Arsenide，Indium Phosphide，Germanium.

■ Surfaces: As-cut, Lapped, Etched, Polished, Patterned.

■ Flat/Notch: All SEMI Standard Flat(s) or Notch.

■ Conductivity: P or N Type.

■ Wafer mounting: Bare Wafer, Sapphire/Quartz Base, Tape.

■ Continuous and 5-point Measurement.

Application :

■Slicing

>>Saw set-up

　　　　>>>Thickness

　　　　>>>TTV

>>Degradation monitoring

>>>Wire guide re-grooving

>>>Blade replacement

■Lap/etch and polishing

>>Process monitoring

>>Thickness

>>TTV

>>Material removal

>>Bow

>>Warp

>>Flatness

■Backgrind

>>Removal rate

■Final Inspection

>>Lot sampling

>>Final thickness

Typical Customer:
American,Europe and Asia and so on.